| 摘要 |
A method for manufacturing a substrate for a semiconductor device is provided to form a flexible substrate having a rigid substrate's property by forming a gap between a portion on which a resist is not coated and applying the resist to the whole strip. At least one or more core layer is formed in a reel manner. The core layer is made of one or more glass fibers and resin materials. A conductive layer is formed on one surface of the core layer so as to form a circuit pattern. A certain circuit pattern is formed on the conductive layer. A longitudinal direction of a strip(10) is arranged in parallel with a traveling direction of the strip in a strip arrangement upon designing the strip of a substrate. In case the strip is successively arranged in the longitudinal direction without a gap, a resist noncoated portion(20) is prepared on both ends of the strip. A copper foil of the resist noncoated portion is plated. In case the strip is arranged in a width direction, a gap of at least 1.5 mm over is formed at every one strip.
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