| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit substrate capable of minimizing the connecting space of an electrode much smaller in a semiconductor device and forming a solder precoat with the thickness of sufficient amount, and to provide a forming method therefor. <P>SOLUTION: A flip-chip mounting substrate 100 has a plurality of connecting pads 130 to be connected to bumps 210, equipped as connecting terminals in a semiconductor chip 200. A plurality of connecting pads are disposed in columns to form a plurality of columns of the connecting pads, and also each of the columns of the connecting pads are arranged in parallel on the surface of the substrate 100. A plurality of the connecting pads 130 on the columns, formed by the adjoining pads, are disposed staggered in the longitudinal direction of the connecting pads. <P>COPYRIGHT: (C)2009,JPO&INPIT |
