| 摘要 |
An interposer is constructed with a substrate body having first and second through-holes, a capacitor formed by a laminating dielectric layer and a second electrode portion on a first electrode portion, which is structured on inner surfaces of first and second through-holes and on the first surface of the substrate body. An insulation layer is formed by filling insulation material in the space within the first through-hole surrounded by second electrode portion, and a first post passes through the insulation layer, one end being electrically connected to the first electrode portion, while the first post is electrically insulated from the second electrode portion. Furthermore, a second post is formed in the second through-hole, and is connected to the second electrode portion at its peripheral surface while being electrically insulated from the first electrode portion. |
