<p>Provided are an anisotropic conductive paste which can perform highly reliable electrical connection even at a high temperature and a high humidity, and a semiconductor device including connections using such anisotropic conductive paste. The anisotropic conductive paste includes an epoxy resin, an imidazole compound, solder particles and insulating inorganic filler. The average particle size of the insulating inorganic filler is smaller than that of the solder particles.</p>
