| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor module capable of testing with high accuracy the connecting state of an internal connection between semiconductor devices, and to provide the semiconductor device. <P>SOLUTION: This semiconductor device module is equipped with switches SW11 or SW13 for connecting a test terminal TT to one end side of wiring which is a test object, and transistors M21 or M23 for imparting a ground potential VSS to the other end side of the wiring which is the test object. Hence, since a current route including the test object wiring can be formed by imparting a supply potential VDD to one end of the test object wiring and imparting the ground potential VSS to other end of the test object wiring, an open failure can be detected. Since a potential difference can be generated between the test object wiring and wiring other than that, by imparting the supply potential VDD to the test object wiring and imparting the ground potential VSS to wiring other than the test object, a short-circuiting failure can be detected. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
