PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING RESIST PATTERN USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition from which a fine resist pattern with a large film thickness and a high aspect ratio can be formed without generating variance in the pattern dimension by improving coating uniformity, and to provide a device for MEMS (microelectro-mechanical system) in which the resist pattern is incorporated as a component.

SOLUTION: The photosensitive resin composition having improved coating uniformity and giving a fine resist pattern with a large film thickness and a high aspect ratio is obtained by adding a silicone-based surfactant into a photosensitive resin composition containing a polyfunctional epoxy resin and a cation polymerization initiator. The device for a MEMS includes the above resist pattern as a component.

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