发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 A part of the opening of the nozzle insertion hole located in the liquid discharging direction relative to the nozzle inserted in the nozzle insertion hole is enlarged in the liquid discharging direction. Therefore, the droplets which have migrated to the nozzle insertion hole adheres to the internal surface in the liquid discharging direction relative to the nozzle, that is, to the slanted part via the enlarged part. Moreover, the slanted part is provided slanted from the central portion of the nozzle insertion hole toward the enlarged part and separated away from the central portion of the substrate top surface. Hence, the adhering droplets flow in the liquid discharging direction along the slanted part to be discharged from the opening of the nozzle insertion hole.
申请公布号 US2008254224(A1) 申请公布日期 2008.10.16
申请号 US20070964421 申请日期 2007.12.26
申请人 KISHIMOTO TAKUYA;MIYA KATSUHIKO 发明人 KISHIMOTO TAKUYA;MIYA KATSUHIKO
分类号 B05D1/02;B05B13/02 主分类号 B05D1/02
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