| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an effective structure for a disk array unit by taking account of high density packaging and cooling capability. <P>SOLUTION: In the basic chassis 100 of the disk array unit, an HDD module 30 is mounted at a part 1 in front of the backboard 20 from a front surface (A), dual CTL modules 10 is mounted on the upper and lower sides of the rear surface (B) at a rear part 2, and dual power modules 40 is equipped with built-in fans 43 on the right and left sides. With operation of the fans 43, one part of cooling air flows into the inside of the CTL module 10, while the other part flows into the inside of each power module 40 at the rear part 2, and the cooling air passed through a duct area 114 made by a block in the CTL module 10 is sucked through a vent hole 96 by the fans 43 in the power modules 40 and exhausted to the outside. The cooling air is separated into flow paths toward a plurality of ICs by the block, and rotation of the fans 43 is controlled by using a temperature sensor 115. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
