| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the warpage of a substrate during the transfer even when the substrate is easily warped. <P>SOLUTION: In a wafer W transfer system for transferring a wafer onto a wafer holder 8, there are provided center pins 9 whose tips being to be inserted into and through openings in the wafer holder 8, auxiliary pins 10A-10C arranged to surround the center pins 9 and to be inserted into and through openings in the wafer holer 8, a moving up/down drive unit 16 for moving up/down the center pins 9, and a support member 18 for coupling the auxiliary pins 10A-10C to the center pins 9 so that when the center pins 9 are moved up and the wafer W is mounted on the center pins 9, the wafer W is also mounted on the auxiliary pins 10A-10C. <P>COPYRIGHT: (C)2009,JPO&INPIT |
