| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor sensor module miniaturized by changing its channel structure when integrating a semiconductor sensor (flow sensor) into a device. SOLUTION: The semiconductor sensor module 1A (1) includes at least the semiconductor sensor 10 having at least a semiconductor substrate, a pressure sensitive part 3 arranged on the semiconductor substrate, and a through hole 4 arranged at least in a part of the pressure sensitive part; and a flexible substrate 11 involving the semiconductor sensor, and having one more channels arranged in communication with the through hole. COPYRIGHT: (C)2009,JPO&INPIT
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