| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition having a good following property with a fine pattern on a substrate plate and capable of becoming a cured material without having a void. SOLUTION: This adhesive composition is provided by containing (A) an epoxy resin having 0.2 to 20 Pa s viscosity at 25°C, (B) at least one kind of a thermoplastic resin selected from a polyimide silicone resin and a phenoxy resin having a functional group reacting with the epoxy resin (A), (C) an epoxy resin-curing catalyst and (D) an inorganic filler, and having 3 to 50 molar ratio of the total amount of the epoxy group in the component (A) to the total amount of the functional group in the component (B). COPYRIGHT: (C)2009,JPO&INPIT
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