CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION FOR THICK FILM AND METHOD FOR MANUFACTURING THICK FILM RESIST PATTERN

摘要

PROBLEM TO BE SOLVED: To provide a chemically amplified positive photoresist composition for a thick film from which a favorable resist pattern having high resolution can be obtained even on a support having a part made of copper on its surface, and to provide a method for manufacturing a thick film resist pattern.

SOLUTION: The chemically amplified positive photoresist composition for a thick film is to be used to form a thick film photoresist layer having a film thickness of 0.1 to 100 μm on a support, and the composition contains an acid generator such as an onium salt having an anionic moiety in a specified structure and a resin having a specified structural unit in a specified compounding ratio.

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