| 摘要 |
<P>PROBLEM TO BE SOLVED: To make improvement of the cooling capacity of a semiconductor laser (LD) chip and its insulation compatible. <P>SOLUTION: Alumite treatment is applied onto the surface of a cooling plate 26. An LD module 27 is fitted to the alumite film of a cooling plate 27. The LD module 27 comprises an LD chip 43, a chip-holding bracket 45, a light guide unit 47, and a drive circuit substrate 49. The chip-holding bracket 45 is secured on the alumite film of the cooling plate 27. The LD chip 43 is secured to the chip-holding bracket 45. The chip-holding bracket 45, that is electrically insulated from the cooling plate 26 by the alumite film, is made of copper having high thermal conductivity. Accordingly, the cooling capacity of the LD chip 43 can be improved and can be electrically insulated, as well. <P>COPYRIGHT: (C)2009,JPO&INPIT |
