EVALUATION METHOD FOR SOLDER JUNCTION PART

摘要

PROBLEM TO BE SOLVED: To provide an evaluation method for a solder junction part advantageous for evaluating a life of the solder junction part. SOLUTION: A base body with the solder junction part is prepared in this evaluation method. The solder junction part is applied with thermal shocks many times. A change of a grain size in a crystal based on the thermal shocks is found in the solder junction part, and the life of the solder junction part is evaluated based on the change of the grain size in the crystal. COPYRIGHT: (C)2009,JPO&INPIT