| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate used for a flexible substrate which is excellent in radiation, has the practical adhesive strength between a conductive layer and insulating layer, can be used as a flexible wiring substrate, and has a good flexibility, and its manufacturing method. SOLUTION: The laminate used for the flexible substrate has a conductive layer on one surface or both surfaces of a polyimide resin layer. The polyimide resin layer is directly formed on the conductive layer, and a heat-conductive filler is contaied into the polyimide resin layer in 30-80 wt.%. The polyimide resin layer is formed in a manner such that a polyamic acid solution containing the heat-conductive filler is directly coated on the conductive layer to be dried and hardened. COPYRIGHT: (C)2009,JPO&INPIT
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