发明名称 EPOXY RESIN COMPOSITION
摘要 <p>Disclosed is a resin composition containing an epoxy compound represented by the formula (1) below and an epoxy compound represented by the formula (2) below. (In the formula (1), R&lt;SUP&gt;1&lt;/SUP&gt;, R&lt;SUP&gt;2&lt;/SUP&gt;, R&lt;SUP&gt;3&lt;/SUP&gt;, R&lt;SUP&gt;4&lt;/SUP&gt; and R&lt;SUP&gt;5&lt;/SUP&gt; each represents a hydrogen atom or an alkyl group having 1-8 carbon atoms; m and n each represents an integer of 0-4; and Ar represents one of the divalent groups represented by the following formulae (a): (a) (wherein R represents a hydrogen atom or an alkyl group having 1-8 carbon atoms).) (In the formula (2), Q represents a linear alkylene group having 1-8 carbon atoms, and a methylene group constituting the linear alkylene group may be substituted by an alkyl group having 1-8 carbon atoms, or -O- or N(R&lt;SUP&gt;6&lt;/SUP&gt;)- may be inserted between methylene groups. In this connection, R&lt;SUP&gt;6&lt;/SUP&gt; represents a hydrogen atom or an alkyl group having 1-8 carbon atoms.)</p>
申请公布号 WO2008123237(A1) 申请公布日期 2008.10.16
申请号 WO2008JP55553 申请日期 2008.03.25
申请人 SUMITOMO CHEMICAL COMPANY, LIMITED;HITACHI, LTD.;TANAKA, SHINYA 发明人 TANAKA, SHINYA
分类号 C08G59/24;C08J5/24 主分类号 C08G59/24
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