Optical communication device and optical communication device manufacturing method

摘要

A device (30150) for optical communication comprises: a substrate (30120) for mounting an IC chip having at least an area for mounting an optical element in which an optical element (31100) is mounted and a resin filled layer for an optical path (31141) is formed, and a multilayered printed circuit board (30100) at which at least an optical waveguide (30118a, 30118b) is formed. The device is constituted such that optical signal can be transmitted between said optical waveguide and said optical element through said resin filled layer for an optical path.