| 摘要 |
<p>A thermal conductive cured product is provided to ensure an easy handling property even in a monolayer or thin film form, and to exhibit a sufficient adhesion capable of fixing the cured product to a device or heat-radiating member easily. A thermal conductive cured product is obtained by applying a composition in a thin film form onto a surface-release-treated substrate for a silicone adhesive, and curing the composition. The composition includes (a) 100 parts by mass of an organopolysiloxane having alkenyl groups, (b) 200-2,000 parts by mass of thermoconductive fillers, (c) an organohydrogenpolysiloxane in a sufficient amount to provide a molar ratio of hydrogen atoms directly bound to a silicon atom in the component (c) to alkenyl groups in the component (a) of 0.5-5.0, (d) a platinum-based compound in an amount of 0.1-1,000 ppm of the component (a) based on a platinum group element, (e) a required amount of a reaction regulator, and (f) 50-300 parts by mass of a silicone resin.</p> |
