| 摘要 |
The heat resistance of a joint between a terminal electrode and a metal terminal as well as the bonding strength of the joint are increased in a ceramic electronic component. The surface of the metal terminal in contact with a binder is formed of a coating layer which is a Ag-based metal plated film. The binder contains a metal powder composed of a Cu-based metal and having an average particle diameter of 2.0 mum or less and a glass component. The step of joining the metal terminal to a terminal electrode via the binder includes bringing the terminal electrode into intimate contact with the metal terminal via the binder and heat-treating them at a temperature in the range of 550° C. to 750° C. to form a Ag-Cu alloy layer between the metal terminal and a metal bonding layer, thus joining the terminal electrode to the metal terminal by Ag-Cu alloy bonding.
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