SAW DEVICE PACKAGE AND FABRICATION METHOD THEREOF

摘要

A SAW device package and a fabricating method thereof are provided to increase a yield in a package manufacturing process by reducing an influence on an internal pattern thereof. A via(210) is formed in a first wafer(200). A first pattern is formed on one surface of the first wafer. The first pattern is electrically connected with the via. A second pattern is formed on the other surface of the first wafer. A cap is formed to cover at least one of the first pattern and the second pattern. The first pattern and the second pattern include a pattern for composing an IDT(Inter-Digital Transducer). The via forming process includes a process for punching a via hole on the first wafer, and a process for filling up a conductive material in the via hole.