| 摘要 |
PROBLEM TO BE SOLVED: To provide a material for heat dissipation having high heat conductivity and an excellent insulating property. SOLUTION: The material for heat dissipation contains an aluminum substrate, an insulating layer formed on one surface and a thermal radiation layer formed on the other one surface. The thermal radiation layer comprises a porous layer of Almilite or a pillar-shaped or projecting Almilite formed substantially perpendicular to a board face, and the insulating layer comprises a composite layer formed of Almilite or the pillar-shaped or projecting Almilite formed substantially perpendicular to the board face, and resin. COPYRIGHT: (C)2009,JPO&INPIT
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