发明名称 DIRECTIONAL COUPLER AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a technology for reducing a directional coupler in size. SOLUTION: A directional coupler 10 comprises a wiring board having a plurality of stacked insulating layers and a plurality of wiring layers wired in a specified pattern on the surface of respective insulating layers, a main line (first wiring) 11 that is formed in a single wiring layer among the plurality of wiring layers, and a sub line (second wiring) 12 which is formed across the plurality of wiring layers and comprises extensions 13a, 13b and 13c extending along the main line 11. The main line 11 comprises no bent part while the sub line 12 is formed to form a coil-like loop on one side surface side of the main line 11. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008244924(A) 申请公布日期 2008.10.09
申请号 JP20070083361 申请日期 2007.03.28
申请人 RENESAS TECHNOLOGY CORP 发明人 KUSUNO YOSHIHIRO;OCHI KENTARO;TAGAMI TOMONORI;SAKURAI SATOSHI;OKABE HIROSHI
分类号 H01P5/18;H01L23/12;H01P1/00;H01P3/08 主分类号 H01P5/18
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