发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device which can be minimized by suppressing the depletion of polycrystalline silicon, and to provide a method of manufacturing the semiconductor device. SOLUTION: The semiconductor device comprises a control gate electrode, having a first layer made of polycrystalline silicon, the first layer is formed by etching back a first film of polycrystalline silicon containing impurity to reduce the thickness of the film, and the first layer holds an impurity activity ratio in the first film. The method of manufacturing the semiconductor device comprises steps of forming the first film, made of polycrystalline silicon containing impurity, by thermally treating an amorphous silicon film provided on an insulating film and reducing the thickness of the first film by etching back the first film. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008244108(A) 申请公布日期 2008.10.09
申请号 JP20070081910 申请日期 2007.03.27
申请人 TOSHIBA CORP 发明人 YABUHARA HIDEHIKO
分类号 H01L21/8247;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/8247
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