发明名称 POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition to be used for ArF excimer laser lithography or the like and suitable for a thermal flow process, and to provide a method for forming a resist pattern. <P>SOLUTION: The positive resist composition contains a resin component (A) which increases solubility to an alkali developer by an effect of an acid, an acid generator component (B) generating an acid by exposure, and a compound (G) expressed by a general formula (I). <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008242011(A) 申请公布日期 2008.10.09
申请号 JP20070081402 申请日期 2007.03.27
申请人 TOKYO OHKA KOGYO CO LTD 发明人 HAYASHI TOMOHIKO;IWAI TAKESHI
分类号 G03F7/004;C08F220/26;G03F7/039;G03F7/40;H01L21/027 主分类号 G03F7/004
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