MOUNTING STRUCTURE OF ELECTRONIC COMPONENT AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

摘要

Disclosed is a technique for suppressing influence of stress during when an electronic component is mounted onto a support using an adhesive containing conductive particles. Specifically disclosed is a mounting structure of an electronic component, which comprises a frame-like insulating frame layer arranged on a support, a resin layer for connection which is arranged within the frame of the insulating frame layer, and an electronic component arranged on the support through the resin layer for connection. The resin layer for connection has a conductive portion for electrically connecting at least a part of the electronic component with at least a part of the support.