| 摘要 |
PROBLEM TO BE SOLVED: To improve the warp and curl of a printed-circuit board by equally curing and shrinking insulating resin layers on the top face and underside of insulating fiber cloth. SOLUTION: The printed-circuit board has a wiring pattern for a conductive material connecting the top face of insulating fiber cloth comprising the aggregate of insulating fibers selected from inorganic fibers or engineering plastics to the underside of the insulating fiber cloth, and the wiring pattern has a structure holding the insulating fibers of the insulating fiber cloth by the wiring pattern. The printed-wiring board further has an opening section at the place of the connecting terminal of the wiring pattern and an insulating resin layer coating the top face and underside of the insulating fiber cloth and a part of the wiring pattern. COPYRIGHT: (C)2009,JPO&INPIT
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