发明名称 MANUFACTURING METHOD OF ELECTRODE SUBSTRATE WITH AUXILIARY WIRING
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of auxiliary wiring and an electrode substrate with transparent auxiliary wiring while preventing corrosion of the auxiliary wiring against an etchant for a transparent conductive film when patterning is applied to the transparent conductive film by a photolithography method so as to efficiently executing patterning between a layered product for auxiliary wiring formation and the transparent conductive film. SOLUTION: This manufacturing method of an electrode substrate with auxiliary wiring is used for applying patterning flatly to a transparent conductive film by a photolithography method to a substrate having the transparent conductive film and patterned auxiliary wiring on the substrate. The manufacturing method of an electrode substrate with auxiliary wiring is characterized in that the auxiliary wiring includes a conductive layer containing Al or an Al alloy as a main constituent, and a cap layer in that order from the substrate side; exposure in the width direction of the auxiliary wiring without being covered with photoresist is not larger than 4μm; and an etchant used for etching of the transparent conductive film is a nonoxidizing acid. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008243451(A) 申请公布日期 2008.10.09
申请号 JP20070079460 申请日期 2007.03.26
申请人 ASAHI GLASS CO LTD 发明人 HIRUMA TAKEHIKO
分类号 H05B33/26;G09F9/00;H01L51/50;H05B33/10 主分类号 H05B33/26
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