| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency shielding case with improved removal working efficiency, and to provide a mounting method of the high-frequency shielding case. SOLUTION: A conductive packing 2 to be brought into contact with the ground for shielding a substrate 5 is inserted into a groove 11 on the mount bottom surface of a lid 1 for shielding in an electronic circuit mounted on the substrate 5; a hook 3 is mounted to an anchor 4 and the lid 1 in the substrate 5; and the hook 3 is hooked and fixed to the anchor 4 by utilizing the compression rebounding force of the packing 2, thereby holding and fixing the lid 1 to the substrate 5. COPYRIGHT: (C)2009,JPO&INPIT
|
