SYSTEM FOR LASER CUTTING AND METHOD FOR LASER CUTTING

摘要

A laser processing system and a method thereof are provided to form a cutting line on a wafer by minimizing vibration transferred to a state from other components. A laser processing system comprises a feeding unit(100), a conveying unit(200) and a processing unit(300). The feeding unit feeds a wafer by preliminarily aligning and coating the wafer to be processed. The conveying unit conveys the wafer from the feeding unit to the processing unit. The processing unit forms a cutting line on the wafer by using a laser. The processing unit is mechanically separated from the feeding unit and the conveying unit in such a manner that vibration generated from the feeding unit and the conveying unit is not transferred to the processing unit.