SHIELD CONDUCTOR LAYER CUTTING METHOD AND LASER TREATMENT DEVICE

摘要

Provided are a shield conductor cutting method and a laser treatment device capable of sufficiently assuring insulation between an internal conductor and a shield conductor layer without leaving a shield line not cut on the shield conductor layer side. The shield conductor layer cutting method includes: a step of preparing a shield cable (1) having a center conductor, an internal insulator arranged to cover the center core, and a shield conductor arranged to cover the internal insulator; and a step of applying a laser beam (12) to the shield conductor layer from at least three directions substantially vertical to the longitudinal direction of the shield cable (1). The angle defined by the two adjacent optical axes of the laser beam applied to the shield conductor layer is less than 180 degrees.