| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad which can keep its dimensional stability high in absorbing moisture or water and has high polishing speed, a manufacturing method thereof, and a method for manufacturing a semiconductor device using the polishing pad. <P>SOLUTION: In this polishing pad having a polishing layer made of polyurethane foam having microbubbles, the polyurethane foam includes (1) isocyanate-terminated prepolymer A containing isocyanate monomer, high molecular weight polyol α, and low molecular weight polyol, (2) isocyanate-terminated prepolymer B containing polymerized diisocyanate and polyethylene glycol with number average molecular weight of 200-1000, and (3) a reaction hardened body reacted with a chain extending agent. <P>COPYRIGHT: (C)2009,JPO&INPIT |
