| 发明名称 |
Polishing Method and Polishing Film Used in Such Polishing Method |
| 摘要 |
Disclosed is a polishing method which is effective to prevent lowering of the polishing efficiency in the later stage of polishing. The polishing method is characterized in that polishing is performed while so adjusting a polishing liquid as to have a pH of not less than 2 and less than 7.
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| 申请公布号 |
US2008248726(A1) |
申请公布日期 |
2008.10.09 |
| 申请号 |
US20040586593 |
申请日期 |
2004.12.09 |
| 申请人 |
BANDO CHEMICAL INDUSTRIES, LTD. |
发明人 |
NAKAHARA MASATAKA;MAEYAMA KATSUAKI;INOUE SHIGEKI |
| 分类号 |
B24B1/00;B24B55/02;B24B19/00;B24B19/22;B24D3/02;B24D3/28;B24D11/00;C09K3/14 |
主分类号 |
B24B1/00 |
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