发明名称 |
AI/AIN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, AND MANUFACTURING METHOD OF AI/AIN JOINT MATERIAL |
摘要 |
A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5 as an amount of boron measured by fluorescence X-ray analysis, and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%. |
申请公布号 |
US2008248326(A1) |
申请公布日期 |
2008.10.09 |
申请号 |
US20080138025 |
申请日期 |
2008.06.12 |
申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
NAGASE TOSHIYUKI;NAGATOMO YOSHIYUKI;KUBO KAZUAKI;NEGISHI TAKESHI |
分类号 |
B32B15/20;B22F3/11;H01L23/12;H01L23/14;H01L23/373;H05K1/03;H05K3/38 |
主分类号 |
B32B15/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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