发明名称 AI/AIN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, AND MANUFACTURING METHOD OF AI/AIN JOINT MATERIAL
摘要 A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5 as an amount of boron measured by fluorescence X-ray analysis, and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%.
申请公布号 US2008248326(A1) 申请公布日期 2008.10.09
申请号 US20080138025 申请日期 2008.06.12
申请人 MITSUBISHI MATERIALS CORPORATION 发明人 NAGASE TOSHIYUKI;NAGATOMO YOSHIYUKI;KUBO KAZUAKI;NEGISHI TAKESHI
分类号 B32B15/20;B22F3/11;H01L23/12;H01L23/14;H01L23/373;H05K1/03;H05K3/38 主分类号 B32B15/20
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