Method for processing semiconductor wafer, for manufacturing semiconductor wafer with revised edge geometry, involves carrying out material removing process of edge of semiconductor wafer

摘要

The method involves carrying out a material removing process of an edge of a semiconductor wafer in connection by a step for processing a side of the semiconductor wafer. A side of the semiconductor wafer is provided with a protective layer before the material removing process of its edge. The material removing process of the edge of the semiconductor wafer take place with the target reduction of a diameter of the semiconductor wafer.