| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit module capable of suppressing warpage to as little as possible by attaching a circuit board to a radiating member. SOLUTION: The manufacturing method of the circuit module 10 comprises a step 1 to prepare a radiating member 2 having a circuit board mounting part 2a with a circuit board 1 attached thereon, and a reinforcing part 2b provided along the outer periphery of the circuit board mounting part 2a with more than double its thickness; a step 2 to dispose the circuit board 1 on the upper side of the circuit board mounting part 2a by a brazing filler material 3; a step 3 to cool the brazing filler material 3 and solidify it after heating to melt it down, and to attach the circuit board 1 onto the circuit board mounting part 2a of the radiating member 2 with the brazing filler material 3; and a step 4 to separate the reinforcing part 2b of the radiating member 2 from the circuit board mounting part 2a. The warpage of the circuit module 10 can be lessened because the stress to get the radiating member 2 dented can be balanced out with the stress to get the circuit board 1 dented in the direction along the outer periphery of the circuit board mounting part 2a. COPYRIGHT: (C)2009,JPO&INPIT |
