发明名称 |
Method and system for thermally processing a plurality of wafer-shaped objects |
摘要 |
Process and system for processing wafer-shaped objects, such as semiconductor wafers is disclosed. In accordance with the present disclosure, a multiple of two wafers are processed in a thermal processing chamber. The thermal processing chamber is in communication with at least one heating device for heating the wafers. The wafers are placed in the thermal processing chamber in a face-to-face configuration or in a back-to-back configuration.
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申请公布号 |
US2008248657(A1) |
申请公布日期 |
2008.10.09 |
申请号 |
US20070784503 |
申请日期 |
2007.04.06 |
申请人 |
NENYEI ZSOLT;TIMANS PAUL J;LERCH WILFRIED;NIESS JUERGEN;FALTER MANFRED;SCHMID PATRICK;O'CARROLL CONOR PATRICK;CARDEMA RUDY;FIDELMAN IGOR;TAY SING-PIN;HU YAO ZHI;DEVINE DANIEL J |
发明人 |
NENYEI ZSOLT;TIMANS PAUL J.;LERCH WILFRIED;NIESS JUERGEN;FALTER MANFRED;SCHMID PATRICK;O'CARROLL CONOR PATRICK;CARDEMA RUDY;FIDELMAN IGOR;TAY SING-PIN;HU YAO ZHI;DEVINE DANIEL J. |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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