METAL FILM POLISHING PAD AND METHOD FOR POLISHING METAL FILM USING THE SAME
摘要
<p>Disclosed is a polishing pad which enables to improve flatness of a polished surface and planarization efficiency, while forming less scratches when used for polishing a metal film which is formed on a semiconductor substrate or the like. Also disclosed is a method for polishing a metal film using such a polishing pad. Specifically disclosed is a metal film polishing pad having a storage modulus at 80°C of 200-900 MPa and a storage modulus at 110°C of not more than 40 MPa. Also specifically disclosed is a method for polishing a metal film using such a polishing pad.</p>