发明名称 METAL FILM POLISHING PAD AND METHOD FOR POLISHING METAL FILM USING THE SAME
摘要 <p>Disclosed is a polishing pad which enables to improve flatness of a polished surface and planarization efficiency, while forming less scratches when used for polishing a metal film which is formed on a semiconductor substrate or the like. Also disclosed is a method for polishing a metal film using such a polishing pad. Specifically disclosed is a metal film polishing pad having a storage modulus at 80°C of 200-900 MPa and a storage modulus at 110°C of not more than 40 MPa. Also specifically disclosed is a method for polishing a metal film using such a polishing pad.</p>
申请公布号 WO2008120578(A1) 申请公布日期 2008.10.09
申请号 WO2008JP55029 申请日期 2008.03.19
申请人 KURARAY CO., LTD.;KATO, MITSURU;KIKUCHI, HIROFUMI;OKAMOTO, CHIHIRO;KATO, SHINYA 发明人 KATO, MITSURU;KIKUCHI, HIROFUMI;OKAMOTO, CHIHIRO;KATO, SHINYA
分类号 H01L21/304;B24B37/24;C08J5/14 主分类号 H01L21/304
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