| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide polishing method and polishing device capable of improving polishing in-plane uniformity, also when including a polishing step difficult to monitor the residual film thickness distribution and a polishing step difficult to obtain a flat polishing profile, regarding the polishing method and polishing device for polishing a film to be polished by a plurality of polishing steps by using a plurality of polishing platens. <P>SOLUTION: This polishing method has a first polishing process for polishing the film to be polished formed on a substrate up to the middle and a second polishing process for further polishing the film to be polished. In the polishing method, a first film thickness profile showing the film thickness distribution of the film to be polished in the second polishing process of the first substrate is measured. The first polishing process of a second substrate is performed to obtain a second film thickness profile having an opposite relation of the size relation of the film thickness to the first film thickness polishing profile. <P>COPYRIGHT: (C)2009,JPO&INPIT |
