摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting polyimide resin composition which gives cured products excellent in heat resistance, electric characteristics, mechanical physical properties, and dimensional stability, and is excellent in storage stability before curing. SOLUTION: This thermosetting polyimide resin composition comprises two or more phenol-based polyimide resins, an epoxy resin, and a curing agent, wherein the curing agent is a triazine-modified novolak type phenolic resin which comprises a mixture of a condensation product (c1) of a phenol compound, a triazine compound and an aldehyde compound, a condensation product (c2) of a triazine compound with an aldehyde compound, a condensation product of a phenol compound with an aldehyde compound, a phenol compound, and a triazine compound, and two kinds of specific structure units are contained in a specific molar ratio in the condensation product (c1) and the condensation product (c2). COPYRIGHT: (C)2009,JPO&INPIT |