| 摘要 |
<P>PROBLEM TO BE SOLVED: To connect a connecting terminal of an electronic component built in a circuit board including built-in components and a connecting electrode of an internal layer circuit of a multilayer circuit board under low loading and low temperature conditions in the method for manufacturing circuit board including built-in components. <P>SOLUTION: Nanoparticle size metal particle 6 having the average grain size of 50 to 200 nm is provided between the connecting terminal 2 and the connecting electrode 5 to attain electrical connection between the connecting terminal 2 and the connecting electrode 5 by sintering the metal particle 6. <P>COPYRIGHT: (C)2009,JPO&INPIT |
