发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board having high reliability, even when if using an anisotropic conductive film. SOLUTION: The multilayer printed wiring board is configured such that at least two printed wiring boards, each having an insulating substrate equipped with conductor circuits having different thicknesses on at least one surface of the front surface and the rear surface of the substrate are laminated, with the conductor circuits having different thicknesses made to face each other via the anisotropic conductive film. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008244290(A) 申请公布日期 2008.10.09
申请号 JP20070084929 申请日期 2007.03.28
申请人 CMK CORP 发明人 KOJIMA MASARU;KOBAYASHI TOSHIYUKI
分类号 H05K1/14;H05K1/02;H05K3/46 主分类号 H05K1/14
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