| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the interference of radiation noise from a semiconductor structure 3 with a semiconductor structure 61 and a chip component 81 in a semiconductor device wherein the semiconductor structure 3 for forming a digital circuit is arranged under a base board 1, an insulating layer 21 is formed under the base board 1 around the semiconductor structure 3, solder balls 34 are formed under the lowermost layer insulating film 32 formed under the semiconductor structure 3 and the insulating layer 21, and a semiconductor structure 61 for forming an analog circuit and a chip component 81 are mounted to the uppermost layer insulating film 49 formed on the base board 1. <P>SOLUTION: The semiconductor structure 61 and the chip component 81 are covered with a sealing film 83, and a shield metal film 85 is formed on the surfaces of the sealing film 83 etc. Thereby, the interference of the radiation noise from the semiconductor structure 3 with the semiconductor structure 61 and the chip component 81 can be reduced. <P>COPYRIGHT: (C)2009,JPO&INPIT |
