发明名称 HEAT DISSIPATION COMPONENT AND HEAT DISSIPATION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a heat dissipation component in which thermal deformation is prevented after ensuring heat dissipation performance, and also to provide a heat dissipation structure. SOLUTION: The heat dissipation component positioned on a flow passage of a heat medium for heat exchange with the heat medium is provided with a plate-like base portion 1 and wall-like fins 3 extending to the base portion 1, wherein the extension shape of each of the wall-like fins has a length component in a direction (x-direction) perpendicular to the flow passage direction, and a length component along the flow passage is <1/2 of the length of the base portion. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008243865(A) 申请公布日期 2008.10.09
申请号 JP20070078011 申请日期 2007.03.24
申请人 SUMITOMO ELECTRIC IND LTD 发明人 MAEDA TAKAO
分类号 H01L23/36;H05K7/20 主分类号 H01L23/36
代理机构 代理人
主权项
地址