COMPOSITE CARBON NANOTUBE-BASED STRUCTURES AND METHODS FOR REMOVING HEAT FROM SOLID-STATE DEVICES
摘要
One embodiment involves an article of manufacture that includes: a copper substrate plug with a front surface and a back surface; a catalyst on top of a single surface of the copper substrate plug; and a thermal interface material on top of the single surface of the copper substrate plug. The thermal interface material comprises: a layer of carbon nanotubes that contacts the catalyst, and a filler material located between the carbon nanotubes. The carbon nanotubes are oriented substantially perpendicular to the single surface of the copper substrate plug. The copper substrate plug is configured to be incorporated in a peripheral structure of a heat spreader or a heat sink. In another embodiment, the thermal interface material is on top of both the top and bottom surfaces of the copper substrate plug.
申请公布号
WO2008121970(A1)
申请公布日期
2008.10.09
申请号
WO2008US58918
申请日期
2008.03.31
申请人
NANOCONDUCTION, INC.;SUHIR, EPHRAIM;KROEZE, ROGER, L.;SCHWARTZ, PETER;RAVINDHRAN, K., S.
发明人
SUHIR, EPHRAIM;KROEZE, ROGER, L.;SCHWARTZ, PETER;RAVINDHRAN, K., S.