| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device having an electrode pad used for both of wiring and a probe pin by eliminating imperfect contact between the electrode pad and a rewiring layer arranged from the electrode pad even when electric characteristic inspection through the probe pin is carried out. SOLUTION: In the semiconductor device equipped with the rewiring layer 31 conducted to the electrode pad 12 arranged on a semiconductor substrate, a protruded object 12a, produced on the surface of the electrode pad 12 because of contact by the probe pin, is covered by an organic insulating film 21 and the rewiring layer 31, conducted to the electrode pad 12, is arranged while covering the protruded object 12a as it is. According to this arrangement, erosion on the surface of the electrode pad 12, which is generated because of the protruded object 12a generated by the contact with the probe pin, is suppressed whereby poor conduction between the electrode pad 12 and the rewiring layer 31 formed thereon can be prevented. As a result, reliability as the semiconductor device is improved. COPYRIGHT: (C)2009,JPO&INPIT
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