| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit which can increase a possibility of arranging multi-cut vias. <P>SOLUTION: A semiconductor integrated circuit 1 includes a single-cut via 60 and a multi-cut via 30 including first and second vias 30a, 30b. An overhang (OHa or OHb) for at least one of the first and second vias 30a, 30b is smaller than an overhang OH for the single-cut via 60. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
