| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a graphic system that executes improved heat transfer for a plurality of chips on a substrate. <P>SOLUTION: The graphic system 300 is provided with a GPU 119 mounted with a first heat sink, a plurality of memory chips 121 mounted with a plurality of peripheral heat sinks 305, 307, and a heat removal system 310 that includes the first heat sink and one or more ducts 407 so as to cool the GPU and a plurality of the memory chips. The ducts are formed by a top 311 and fins 405 so as to communicate with a fan 303. The ducts bring a cooling air flow into contact with the first heat sink so as to substantially direct the cooling air flow toward the memory chips via the first heat sink. The size and direction of each fin are adjusted in order to uniformly cool a plurality of the memory chips by allowing a plurality of the peripheral heat sinks to direct a cooling air flow from the fan. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
