发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND RESIST PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of suppressing viscosity reduction over time and capable of stably forming a thick film resist pattern, a resist pattern forming method and a touch panel device including a resist pattern formed using the resist pattern forming method as a spacer. <P>SOLUTION: The photosensitive resin composition comprises (A) an acrylic resin, (B) a monomer having an ethylenically unsaturated group, (C) a photopolymerization initiator and (D) a solvent which is dissolved in 100 g of water at 25&deg;C in an amount of &ge;20 g. The resist pattern is obtained as follows; the photosensitive resin composition is applied on a support, dried, subjected to predetermined pattern exposure and developed. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008233289(A) 申请公布日期 2008.10.02
申请号 JP20070069954 申请日期 2007.03.19
申请人 TOKYO OHKA KOGYO CO LTD 发明人 ISHIKAWA KAORU;MASUDA YASUO;SAITO KOJI
分类号 G03F7/004;G02F1/1339 主分类号 G03F7/004
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