CHIP SCALE POWER CONVERTER PACKAGE HAVING AN INDUCTOR SUBSTRATE
摘要
A chip scale power converter package having an inductor substrate and a power integrated circuit flipped onto the inductor substrate is disclosed. The inductor substrate includes a high resistivity substrate having a planar spiral inductor formed thereon.
申请公布号
WO2008118489(A1)
申请公布日期
2008.10.02
申请号
WO2008US04032
申请日期
2008.03.27
申请人
ALPHA & OMEGA SEMICONDUCTOR LIMITED;HEBERT, FRANCOIS;SUN, MING
