| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a means of improving reliability while reducing a cost and simplifying a manufacturing process for a manufacturing method of an electronic device having a structure for connecting a substrate body with a conductive pattern formed thereon via an insulation layer using a bump, a substrate and a semiconductor device. <P>SOLUTION: The manufacturing method includes a step of forming the bump 104 having a protrusion on an electrode pad 103 formed on a semiconductor chip 101A, a step of exposing part of the protrusion from an upper surface of the insulation layer 105 formed on the semiconductor chip 101A, a step of forming a conductive layer 107A on the upper surface of the insulation layer 105 and a part where a tip 104D is exposed, a step of removing a protruding part opposite to the tip 104D of the conductive layer 107A by a grinding roll 112 to expose from the conductive layer 107A and a step of forming the conductive layer by electroplating using the conductive layer 107A as a feeding layer and also patterning it. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
